NOBELPLA 87455 – Thermally Conductive Silicone Adhesive for TV Mainboard Chips

 

Item	Specification / Description
Product Name	NOBELPL A 87455
Product Type	One-Component Thermally Conductive Silicone Adhesive / Paste
Target Application	Thermal management for TV mainboard chips, heat sinks, memory modules, power transistors, and CPUs
Chemistry	Silicone-based
Curing Mechanism	Non-curing / Ready-to-use thermal interface material
Color	Grey paste
Specific Gravity	3.6
Thermal Conductivity	5.0 W/(m·K)
Typical Bond Line Thickness (BLT)	75 μm
Oil Scatteration	≤1.0%
Primary Function	Thermally conductive interface for heat dissipation
Mechanical Properties	Highly filled, non-flowing compound; easy to remove from substrate
Processability	Suitable for manual or automated dispensing; maintains position during assembly
Customization	Formulation customizable for specific thermal performance and processing requirements

 

 

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Product Summary

 

NOBELPLA87455 is a high-performance, highly filled silicone-based thermal paste engineered for TV mainboard assemblies. It delivers moderate thermal conductivity (5.0 W/m·K) and maintains a consistent bond line thickness of 75 μm, ensuring efficient heat transfer for chips, memory modules, power transistors, and CPUs.

 

The non-flowing formulation prevents material migration during assembly while being easy to remove or rework if necessary. Minimal oil scatteration (≤1.0%) ensures clean processing and reliable thermal performance. Customizable formulations make NOBELPLA87455 a versatile solution for advanced electronics thermal management applications.

 

 

 

 

COLLTECH NOBELPLA Advanced Electronic Adhesives & Thermal Management Materials – Technical FAQ

1. What product categories does COLLTECH NOBELPLA specialize in?

We specialize in high-performance electronic adhesives including structural bonding systems, thermal interface materials (TIMs), encapsulants, potting compounds, conformal coatings, UV-curable adhesives, and electrically conductive formulations.

2. Which industries are your materials designed for?

Our materials are engineered for PCB assembly, power electronics, automotive electronics, LED modules, battery management systems (BMS), industrial control units, and semiconductor-related applications.

3. What polymer technologies are available in your portfolio?

Our portfolio includes epoxy, silicone (RTV and addition-cure), polyurethane, acrylic, UV-curable, and hybrid polymer systems optimized for electronic reliability.

4. Do you provide thermally conductive yet electrically insulating materials?

Yes. Our thermally conductive formulations enhance heat dissipation while maintaining excellent dielectric strength and electrical insulation.

5. What applications typically require your thermal interface materials?

TIMs are widely used in IGBT modules, inverters, power supplies, LED assemblies, battery packs, and heat sink bonding applications.

6. Are gap-filling materials available for uneven substrates?

Yes. We offer gap-filling solutions with controlled rheology to accommodate surface tolerances and maintain efficient thermal transfer.

7. Do you offer electrically conductive adhesives (ECA)?

Yes. Silver-filled conductive adhesives are available for EMI shielding, grounding, and selective electrical interconnection.

8. What curing mechanisms do your materials support?

We support heat cure, room-temperature cure, moisture cure, UV cure, and dual-cure systems to meet diverse manufacturing requirements.

9. Are your materials compatible with automated dispensing systems?

Yes. Our formulations are optimized for needle dispensing, jetting equipment, and robotic assembly lines to ensure consistent process performance.

10. Do you provide low-viscosity grades for compact assemblies?

Yes. Low-viscosity materials improve wetting performance, capillary flow, and void reduction in densely populated electronic assemblies.

11. Are thixotropic or non-sag formulations available?

Yes. High-thixotropy systems are available for vertical bonding and precision component placement.

12. What temperature performance can your materials achieve?

Depending on formulation, our materials are engineered to operate reliably under both standard and elevated temperature conditions.

13. Are your adhesives resistant to thermal cycling?

Yes. Many formulations are designed to maintain mechanical integrity and electrical stability under repeated thermal cycling.

14. Do you offer low-modulus materials to mitigate stress?

Yes. Flexible silicone and hybrid systems help reduce thermo-mechanical stress caused by CTE mismatch between substrates.

15. Are low-CTE formulations available?

Yes. Low coefficient of thermal expansion (CTE) materials are available for applications requiring enhanced dimensional stability.

16. Do you provide encapsulation materials for environmental protection?

Yes. Epoxy, silicone, and polyurethane encapsulants protect electronics from moisture ingress, vibration, dust, and chemical exposure.

17. Are flame-retardant grades available?

Yes. Selected formulations are designed to meet flame-retardant requirements for safety-critical electronic systems.

18. Do you offer conformal coating solutions?

Yes. Conformal coatings are available to protect PCBs from humidity, corrosion, and environmental contaminants.

19. Are your materials compliant with global environmental regulations?

Yes. Our products comply with major international regulatory standards. Compliance documentation is available upon request.

20. What key performance parameters are evaluated for your materials?

Critical parameters include thermal conductivity, dielectric strength, volume resistivity, Tg, modulus, CTE, viscosity profile, and long-term reliability performance.

21. Is batch traceability implemented in your production process?

Yes. Full lot traceability ensures consistent product quality and manufacturing reproducibility.

22. Can custom formulations be developed for specific applications?

Yes. We provide application-driven customization based on targeted thermal, mechanical, electrical, and processing requirements.

23. Can viscosity and cure profiles be optimized?

Within technical feasibility, viscosity, working time, and curing speed can be tailored to support manufacturing efficiency.

24. Do you support prototype validation and qualification testing?

Yes. Our technical team supports sample evaluation, pilot production trials, and product qualification processes.

25. Are your materials suitable for automotive-grade electronics?

Yes. Our materials are engineered to withstand vibration, humidity, and harsh thermal environments typical of automotive applications.

26. Do you provide solutions for high-power density electronics?

Yes. Our thermal management materials are designed to reduce interface thermal resistance and maintain long-term stability under continuous heat load.

27. What packaging formats are available?

Products are supplied in syringes, cartridges, pails, and drums to support laboratory evaluation through mass production.

28. What is the typical shelf life of your products?

Shelf life varies by formulation and storage conditions. Please refer to the relevant Technical Data Sheet (TDS) for details.

29. Do you provide global supply and logistics support?

Yes. We support international customers with coordinated logistics services and export documentation.

30. How can customers request samples or technical consultation?

Customers may contact our sales and engineering teams through the official website to request samples, quotations, or application support.