Key Features:
Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range
of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
Product Name :
NOBELPLA 85309Color :
BlackHardness :
46ALap Shear Strength [MPa] :
3.2 (Steel to steel)Note :
CustomizableTack Free time[min] :
5-15Elongation @ Break [%] :
>250
| Item | Specification / Description |
|---|---|
| Product Name | NOBELPLA 85309 |
| Product Type | Modified Silicone Adhesive / Sealant |
| Target Application | TWS Bluetooth headset earbuds; light guide pillar dispensing fixation; electronic component bonding |
| Chemistry | Silicon-based (modified silane system) |
| Curing Method | Moisture-curing (RTV type) |
| Color | Black |
| Hardness | Shore A 46 |
| Lap Shear Strength | 3.2 MPa (steel-to-steel) |
| Elongation at Break | > 250% |
| Tack-Free Time | 5–15 minutes |
| Primary Functions | Sealing, Encapsulation, Structural Bonding |
| Adhesion Performance | Excellent adhesion to a wide range of substrates including metals, plastics, and electronic components |
| Mechanical Performance | Outstanding impact resistance and vibration resistance; high initial bond strength |
| Environmental & Safety | Organotin-free formulation |
| Customization | Formulation customizable based on process and performance requirements |
NOBELPLA 85309 is a modified silicone adhesive specifically engineered for TWS Bluetooth earbud assemblies, particularly for light guide pillar dispensing fixation and precision electronic component bonding. Based on a silane-modified silicone chemistry, the material delivers excellent adhesion to diverse substrates while maintaining high initial bond strength for fast assembly handling.
With a Shore A hardness of 46 and elongation at break exceeding 250%, the cured elastomer provides an optimal balance of flexibility and structural integrity. It effectively absorbs mechanical shock and vibration, ensuring long-term durability in compact wearable electronic devices.
The fast tack-free time of 5–15 minutes supports high-throughput production lines. Additionally, the organotin-free formulation enhances environmental compliance. Customizable performance options further enable optimization for specific acoustic, structural, and manufacturing requirements in advanced TWS headset applications.
We provide thermally conductive interface materials (TIMs), structural bonding adhesives, encapsulants, potting compounds, conformal coatings, UV-curable adhesives, and electrically conductive systems for electronic assemblies.
Our products are engineered for PCB assembly, power electronics, automotive electronics, LED modules, battery management systems (BMS), industrial automation, and semiconductor-related applications.
Our formulations are based on epoxy, silicone (RTV and addition-cure), polyurethane, acrylic, UV-curable, and hybrid polymer systems optimized for high reliability.
A TIM is a thermally conductive compound applied between heat-generating components and heat-dissipating surfaces to reduce interfacial thermal resistance and enhance heat transfer efficiency.
Yes. Most TIM formulations combine high thermal conductivity with excellent dielectric strength and electrical insulation performance.
Thermal conductivity depends on filler technology and formulation design. Multiple grades are available to support different heat flux and power density requirements.
Yes. Our gap-filling materials feature controlled rheology to accommodate uneven substrates while maintaining stable thermal performance.
Yes. Silver-filled conductive adhesives are available for EMI shielding, grounding, and selective electrical interconnection applications.
Our materials support heat cure, room-temperature cure, moisture cure, UV cure, and dual-cure systems to match diverse production processes.
Yes. Formulations are optimized for needle dispensing, jetting systems, screen printing, and robotic assembly lines.
Yes. Low-viscosity materials enhance wetting, capillary flow, and void reduction in densely populated electronic assemblies.
Yes. High-thixotropy systems are designed for vertical bonding and precise material placement.
Depending on chemistry, our materials are engineered to operate reliably under both standard and elevated temperature environments.
Yes. Many formulations are designed to maintain mechanical integrity and electrical stability under repeated thermal cycling.
Yes. Flexible silicone and hybrid systems help mitigate thermo-mechanical stress caused by CTE mismatch between substrates.
CTE (Coefficient of Thermal Expansion) control minimizes stress during temperature fluctuations, thereby improving long-term reliability and preventing delamination or cracking.
Yes. Our encapsulants protect electronic components from moisture ingress, vibration, dust, and chemical exposure.
Yes. Selected formulations are designed to meet flame-retardant standards required for safety-critical electronics.
Yes. Conformal coatings are available to protect PCBs from humidity, corrosion, and environmental contaminants.
Key parameters include thermal conductivity, dielectric strength, volume resistivity, glass transition temperature (Tg), CTE, modulus, viscosity profile, and long-term aging stability.
Yes. Our materials comply with major international standards such as RoHS and REACH.
Yes. Batch traceability ensures consistent quality control and production reproducibility.
Yes. We offer application-driven customization based on thermal, electrical, mechanical, and processing requirements.
Within technical feasibility, viscosity, pot life, working time, and curing profiles can be adjusted to improve manufacturing efficiency.
Yes. Our technical team supports sample evaluation, pilot production trials, and reliability qualification processes.
Yes. Our formulations are engineered to withstand vibration, humidity, and harsh thermal environments typical in automotive systems.
Yes. Our thermal management materials are designed to reduce interface thermal resistance and improve heat dissipation efficiency.
Products are supplied in syringes, cartridges, pails, and drums to support laboratory testing and high-volume production.
Shelf life depends on formulation and storage conditions. Detailed guidance is provided in the Technical Data Sheet (TDS).
Customers may contact our sales and engineering teams via the official website to request samples, quotations, and application support.
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