Key Features:
Excellent resistance to mechanical shock and vibration, outstanding ductility,
superior interfacial wetting performance, high thermal conductivity (>2.0 W/m·K),
and compliance with the UL94 V-0 flame retardancy rating.
Product Name :
NOBELPLA85189Color :
BlueMixture Ratio :
1:1Note :
CustomizableThermal [W/(m-K)] :
>2.0Specific Gravity :
2:1Hardness :
60A
| Item | Specification / Description |
|---|---|
| Product Name | NOBELPLA85189 |
| Product Type | Two-Component Silicone Thermal Conductive Adhesive |
| Target Application | Smart home appliances, power modules, heat-generating electronic components |
| Chemistry | Silicone-based formulation |
| Curing System | Two-component curing system |
| Mixing Ratio | 1:1 (by volume) |
| Color | Blue |
| Thermal Conductivity | > 2.0 W/m·K |
| Flame Retardancy | UL94 V-0 compliant |
| Specific Gravity | 2.1 (typical) |
| Viscosity (Mixed) | 6,000 mPa·s |
| Primary Function | Thermal conduction and structural bonding |
| Mechanical Performance | Excellent resistance to mechanical shock and vibration; high ductility for stress absorption |
| Interfacial Performance | Superior substrate wetting for reduced thermal interface resistance |
| Customization | Formulation customizable based on thermal and mechanical requirements |
NOBELPLA85189 is a high-performance, two-component silicone-based thermal conductive adhesive designed for smart home appliance electronics and heat-generating components. With a thermal conductivity exceeding 2.0 W/m·K, the material ensures efficient heat dissipation and enhanced thermal management reliability.
Its excellent interfacial wetting capability minimizes thermal interface resistance, improving heat transfer efficiency between substrates. The cured material demonstrates outstanding resistance to mechanical shock and vibration, along with high ductility to accommodate thermal expansion mismatch and mechanical stress.
Compliant with UL94 V-0 flame retardancy requirements, NOBELPLA85189 meets stringent safety standards for electronic applications. The 1:1 mix ratio enables convenient processing, and customizable formulations allow optimization for specific thermal, mechanical, and manufacturing requirements.
We provide structural adhesives, thermal interface materials, encapsulants, potting compounds, UV-curable adhesives, and conductive adhesive solutions for electronic assemblies.
Our products serve PCB assembly, automotive electronics, LED systems, battery modules, power electronics, industrial automation, and semiconductor-related applications.
We supply epoxy, silicone (RTV and addition-cure), acrylic, polyurethane, UV-curable, and hybrid polymer systems optimized for electronics.
TIMs are thermally conductive materials placed between heat-generating components and heat sinks to improve heat dissipation in power modules and LED systems.
Yes. Most thermal products are electrically insulating with high dielectric strength unless specifically formulated as conductive grades.
Yes. Silver-filled conductive adhesives are available for EMI shielding, grounding, and electrical interconnection applications.
We support thermal cure, room-temperature cure, moisture cure, UV cure, and dual-cure systems (e.g., UV + heat or UV + moisture).
Yes. Our UV-curable formulations are optimized for automated dispensing and rapid curing in high-volume electronics manufacturing.
We offer epoxy, silicone, and polyurethane encapsulants for environmental protection and mechanical reinforcement of electronic components.
Yes. Low-viscosity grades are available to improve flow and minimize trapped air in dense PCB assemblies.
Yes. Selected products are engineered with flame-retardant properties for safety-critical electronic applications.
Depending on the formulation, our materials are engineered for both standard and elevated operating temperature ranges.
Yes. Our adhesive and thermal materials are designed to withstand thermal cycling, vibration, and humidity typical of automotive environments.
Yes. Our products are formulated to meet the performance and reliability demands of mission-critical electronics.
Yes. Flexible silicone and hybrid systems help minimize mechanical stress on sensitive assemblies.
Yes. Low-CTE materials are offered to reduce thermally induced mechanical stress in multi-material assemblies.
Yes. Many formulations are engineered for long-term reliability through repeated thermal cycles and environmental stress.
Yes. Protective coatings are offered to guard PCBs against moisture, dust, and corrosive environments.
Yes. Compliance documentation is available upon request for standard regulatory requirements.
Yes. We provide full TDS and SDS documentation for all products.
Yes. We maintain batch-level traceability to ensure consistent quality and manufacturing reproducibility.
Yes. We offer custom formulation development based on specific performance and processing requirements.
Yes. Within technical feasibility, viscosity, working time, and cure profile can be tailored to meet production needs.
Yes. We provide technical support and sample recommendations for prototype evaluation and pilot runs.
Products are supplied in cartridges, syringes, pails, and drums to support varying production scales.
Shelf life varies by product chemistry. Please refer to the specific TDS for storage conditions and expiration guidance.
Yes. We support international shipping and necessary export compliance documentation.
Yes. Test summaries and performance data are available upon request for qualified projects.
Yes. We support strategic supply agreements for key customers and high-volume production programs.
Customers can contact our sales and technical team via the official website contact form to receive prompt support and quotes.
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