Electronic Thermal Management Adhesive for Memory, CPU & Power Transistor Heat Control, NOBELPLA 87455
| Item |
Specification / Description |
| Product Name |
NOBELPLA87455 |
| Product Type |
One-Component Thermal Grease |
| Target Application |
Thermal management for heat sinks, memory modules, chips, power transistors, CPUs |
| Chemistry |
Silicone-based |
| Curing Mechanism |
Non-curing, ready-to-use thermal interface material |
| Color |
Grey paste |
| Specific Gravity |
3.6 |
| Thermal Conductivity |
5.0 W/(m·K) |
| Bond Line Thickness (BLT) |
75 μm (typical) |
| Oil Scatteration |
≤1.0% |
| Primary Function |
Thermally conductive interface for heat dissipation |
| Processability |
Non-flowing, easy to remove from substrate |
| Customization |
Formulation can be tailored for specific thermal management requirements |
Product Summary
NOBELPLA87455 is a high-performance, one-component thermal grease designed for efficient heat dissipation in electronic assemblies. The material is a highly filled, non-flowing silicone-based compound that provides moderate thermal conductivity (5.0 W/m·K) and ensures reliable thermal contact between heat-generating components and heat sinks.
Ideal for CPUs, power transistors, memory chips, and other critical components, NOBELPLA87455 maintains a typical bond line thickness of 75 μm and exhibits minimal oil scatteration (≤1.0%), facilitating clean and consistent application. Its non-curing nature makes it easy to remove or rework from substrates, supporting flexible maintenance and assembly processes.
With customizable formulations, NOBELPLA87455 provides a robust and reliable thermal interface solution for advanced electronic thermal management applications.
COLLTECH NOBELPLA Advanced Electronic Adhesives & Thermal Management Materials – Technical FAQ
1. What product categories does COLLTECH NOBELPLA specialize in?
We specialize in thermally conductive interface materials (TIMs), structural bonding adhesives, encapsulants, potting compounds, conformal coatings, UV-curable systems, and electrically conductive adhesives for electronic applications.
2. Which markets do your materials primarily serve?
Our products are widely applied in PCB assembly, power electronics, automotive electronics, LED lighting, battery management systems (BMS), industrial automation, and semiconductor-related industries.
3. What polymer platforms are used in your formulations?
Our technologies are based on epoxy, silicone (RTV and addition-cure), polyurethane, acrylic, UV-curable, and hybrid polymer systems engineered for high reliability and process stability.
4. What is the purpose of a Thermal Interface Material (TIM)?
A TIM minimizes interfacial thermal resistance between heat-generating components and heat-dissipation structures, ensuring efficient heat transfer and improved system longevity.
5. Do your thermally conductive materials maintain dielectric insulation?
Yes. Most of our TIM solutions combine enhanced thermal conductivity with high dielectric strength and electrical insulation properties.
6. What thermal conductivity ranges are achievable?
Thermal conductivity varies depending on filler type and loading. Multiple grades are available to address different thermal management requirements.
7. Do you offer gap-filling thermal compounds?
Yes. Our gap fillers are engineered with optimized rheology to accommodate surface irregularities while maintaining consistent thermal performance.
8. Are electrically conductive adhesives (ECA) available?
Yes. We offer silver-filled conductive adhesives for EMI shielding, grounding, and selective electrical interconnection.
9. What curing technologies are supported?
We support heat curing, room-temperature curing, moisture curing, UV curing, and dual-cure systems to accommodate diverse assembly processes.
10. Are your materials compatible with automated dispensing equipment?
Yes. Our products are optimized for precision needle dispensing, jetting systems, screen printing, and robotic manufacturing lines.
11. Do you provide low-viscosity grades for high-density assemblies?
Yes. Low-viscosity materials enhance wetting performance and reduce void formation in compact electronic modules.
12. Are thixotropic or non-sag options available?
Yes. High-thixotropy formulations ensure controlled placement and prevent material flow in vertical applications.
13. What temperature resistance can your materials achieve?
Depending on chemistry, our materials are engineered to withstand both standard operating temperatures and elevated thermal environments.
14. Are your products resistant to thermal cycling stress?
Yes. Many formulations are developed to maintain mechanical adhesion and electrical stability under repeated thermal cycling conditions.
15. Do you provide low-modulus systems for stress-sensitive components?
Yes. Flexible silicone and hybrid systems help mitigate stress caused by CTE mismatch between dissimilar materials.
16. Why is CTE control critical in electronic packaging?
CTE (Coefficient of Thermal Expansion) control reduces mechanical stress during temperature fluctuations, enhancing long-term reliability and preventing cracking or delamination.
17. Do you offer encapsulants for environmental protection?
Yes. Our encapsulation materials protect electronic assemblies against moisture ingress, vibration, dust contamination, and chemical exposure.
18. Are flame-retardant materials available?
Yes. Selected grades are designed to meet flame-retardant requirements for safety-critical electronics.
19. Do you supply conformal coating solutions?
Yes. Conformal coatings protect PCBs from humidity, corrosion, and environmental contaminants.
20. What key performance parameters are evaluated during product development?
Parameters include thermal conductivity, dielectric strength, volume resistivity, glass transition temperature (Tg), CTE, modulus, viscosity profile, and long-term aging performance.
21. Are your products compliant with international environmental regulations?
Yes. Our materials comply with major global standards such as RoHS and REACH.
22. Is production batch traceability implemented?
Yes. Full lot traceability ensures consistent quality control and manufacturing reproducibility.
23. Can formulations be customized for specific application requirements?
Yes. We offer application-driven customization based on required thermal, mechanical, electrical, and processing characteristics.
24. Can cure speed, viscosity, and pot life be optimized?
Within technical feasibility, working time, viscosity, and curing profiles can be tailored to enhance manufacturing efficiency.
25. Do you support prototype validation and reliability qualification?
Yes. Our technical team assists with sample evaluation, pilot production trials, and qualification testing.
26. Are your materials suitable for automotive electronics?
Yes. Our formulations are engineered to withstand vibration, humidity, and harsh temperature environments common in automotive applications.
27. Do you provide solutions for high-power and high-density modules?
Yes. Our thermal management materials are designed to reduce thermal resistance and support efficient heat dissipation in high-power devices.
28. What packaging formats are available?
Products are supplied in syringes, cartridges, pails, and drums to support laboratory development and large-scale production.
29. What is the recommended storage and shelf life?
Shelf life varies by formulation and storage condition. Specific guidance is provided in each Technical Data Sheet (TDS).
30. How can customers request samples or technical consultation?
Customers may contact our sales and engineering teams via the official website to request samples, quotations, and application support.
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