Key Features:
With excellent electrical properties, excellent moisture and solvent resistance,
and excellent high temperature resistance
Product Name :
NOBELPLA85309Color :
Transparent / BlackHardness :
25 ACuring Condition :
@25 °C, 50%RH for 24 hours; @150°C for 15 minsVolume [Ω.cm] :
>1x10¹5Viscosity / Mixed [mPa.s] :
27,000Note :
Customizable
| Item | Specification / Description |
|---|---|
| Product Name | NOBELPLA85309 |
| Product Type | Two-Component Silicone Adhesive / Sealant |
| Target Application | Smart home appliances, electronic module protection, PCB encapsulation |
| Chemistry | Silicone-based formulation |
| Curing Mechanism | Two-component curing system |
| Curing Conditions | 24 hours @ 25°C, 50% RH; or 15 minutes @ 150°C (accelerated thermal cure) |
| Color Options | Transparent / Black |
| Hardness | Shore A 25 |
| Mixed Viscosity | 27,000 mPa·s |
| Volume Resistivity | > 1 × 10¹⁵ Ω·cm |
| Primary Functions | Sealing, Encapsulation, Electrical Insulation |
| Electrical Properties | Excellent dielectric insulation performance with ultra-high volume resistivity |
| Environmental Resistance | Superior resistance to moisture and common solvents |
| Thermal Resistance | Excellent high-temperature stability and long-term reliability |
| Mechanical Characteristics | Flexible elastomer with low modulus for stress absorption and vibration damping |
| Customization | Formulation and properties customizable based on application requirements |
NOBELPLA85309 is a high-performance, two-component silicone adhesive and sealant engineered for smart home electronic assemblies. The material provides outstanding dielectric insulation with a volume resistivity greater than 1 × 10¹⁵ Ω·cm, ensuring reliable protection of sensitive electronic components.
Its excellent resistance to moisture, solvents, and elevated temperatures makes it suitable for demanding operating environments. With a Shore A hardness of 25, the cured elastomer maintains flexibility, effectively mitigating mechanical stress and vibration.
The dual curing capability—room temperature curing or rapid heat curing—offers enhanced manufacturing flexibility and process efficiency. Additionally, customizable formulations allow optimization for specific design and performance requirements, making NOBELPLA85309 an ideal solution for sealing and encapsulation applications in smart home and consumer electronic devices.






We offer structural adhesives, thermally conductive gels/pastes, encapsulants, potting compounds, UV-curable adhesives, and electrically conductive adhesives tailored for electronic assemblies.
Our products are used in consumer electronics, automotive electronics, power modules, LED lighting, battery packs, industrial control systems, and semiconductor manufacturing.
We provide epoxy, silicone (RTV and addition-cure), acrylic, polyurethane, UV-curable, and hybrid adhesive systems.
Yes — both thermally conductive and electrically insulating materials designed to enhance heat dissipation in electronic modules.
TIMs are commonly used for CPUs, power modules, LED arrays, inverters, battery systems, and heat sink bonding.
Yes. Most structural and thermally conductive products are electrically insulating unless specified as conductive.
Yes — silver-filled conductive adhesives are available for EMI shielding, grounding, and selective circuit connections.
We support heat-cure, room-temperature cure, moisture curing, UV curing, and dual-cure systems (e.g., UV + heat).
Yes. They are optimized for automated dispensing and rapid curing in high-volume electronics manufacturing.
We provide epoxy, silicone, and polyurethane encapsulants for environmental protection and mechanical reinforcement of PCBs and modules.
Yes. Low-viscosity grades are designed for improved flow and reduced void formation during potting.
Yes. Selected products are formulated to meet flame-retardant requirements for safety-critical electronics.
Adhesive temperature performance varies by formulation — from standard operating ranges to high-temperature applications over +150°C.
Yes. We offer high-reliability products engineered for vibration resistance, thermal cycling, and high humidity environments common in automotive use.
Yes — flexible silicone and hybrid systems reduce stress in delicate assemblies with thermal expansion differences.
Yes — low CTE formulations help minimize mechanical stress in semiconductor and multi-material assemblies.
Yes. Many formulations are engineered for long-term reliability under thermal cycling and environmental stress.
Yes — protective coatings are available to guard against moisture, dust, and corrosion.
Yes — compliance documentation is available upon request.
Yes. Detailed TDS and SDS documentation is available for all products.
Yes. Full batch traceability is maintained to ensure consistent quality and manufacturing assurance.
Yes — we offer custom formulation services based on application requirements and performance criteria.
Within technical feasibility, viscosity, working time, and cure profiles can be optimized for specific processes.
Yes. We provide technical support and sample guidance for prototyping and pilot production runs.
Products are available in syringes, cartridges, pails, and drums to support different production volumes.
Shelf life varies by product chemistry. Please consult the product’s TDS for specific storage and expiration guidance.
Yes — international shipping and necessary export documentation support are available.
Yes — performance data and reliability test summaries are available upon request for qualified projects.
Yes — structured supply and inventory programs can be arranged for strategic partners.
Customers can submit inquiries through our website contact form or direct sales channels to receive prompt technical support and quotations.
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