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Adhesive Application Solution for Smart VR/AR Head-mounted Display NOBELPLA14463

Adhesive Application Solution for Smart VR/AR Head-mounted Display NOBELPLA14463

Key Features: 

In-line UV curable acrylic gasket for sealing, potting and bonding plastic, glass, metal and FR4,

as well as protecting sensitive components on PCB/FPCB, good flexibility and high elongation,

good waterproof performance.

  • Product Name :

    NOBELPLA14463
  • Color :

    Blue
  • Hardness :

    35 A
  • Lap Shear Strength [MPa] :

    6 (PC to PC)
  • Note :

    Customizable
  • Viscosity [mPa.s] :

    36000
  • Curing Condition :

    @365nm, 100mW/cm2 for 30 secs
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NOBELPLA14463 Adhesive Application Solution for Smart VR/AR Head-Mounted Displays

 

 

Item Description
Product Overview NOBELPLA14463 is a high-performance UV-curable adhesive specifically developed for smart VR/AR head-mounted display assembly. It is designed to meet the demanding requirements of precision electronics bonding, offering excellent flexibility, high elongation, and reliable waterproof protection.
Key Features • Good flexibility and high elongation, effectively absorbing mechanical stress and vibration
• Excellent waterproof performance, enhancing long-term reliability in humid environments
• Fast UV curing for high production efficiency
• Stable bonding performance for plastic substrates
Typical Applications Suitable for bonding and sealing components in VR/AR head-mounted displays, including optical modules, housing structures, and internal electronic assemblies where flexibility and durability are required.
Product Name NOBELPLA14463
Color Blue
Viscosity 36,000 mPa·s
Curing Condition UV curing @ 365 nm, 100 mW/cm² for 30 seconds
Hardness Shore A 35
Tensile Strength 6 MPa (PC to PC)
Performance Advantages

The balanced mechanical properties of NOBELPLA14463 ensure strong adhesion while maintaining elasticity, reducing the risk of cracking or delamination during thermal cycling or repeated use. Its rapid UV curing capability supports automated production lines and improves manufacturing efficiency.

 

 

 

 

 

 

COLLTECH NOBELPLA Electronic Adhesive Solutions – Technical FAQ

 


1. What core adhesive solutions does COLLTECH NOBELPLA provide for the electronics industry?

We supply high-performance electronic adhesives including structural bonding systems, thermal interface materials (TIMs), encapsulants, potting compounds, UV-curable adhesives, and electrically conductive formulations.


2. Which electronic applications are your materials designed for?

Our products are used in PCB assembly, power electronics, LED modules, battery systems, automotive electronics, industrial control units, and semiconductor-related applications.


3. What adhesive chemistries are available?

We offer epoxy, silicone (RTV and addition-cure), acrylic, polyurethane, UV-curable, and hybrid polymer systems tailored for electronic performance requirements.


4. Do you provide thermally conductive adhesives?

Yes. We offer thermally conductive and electrically insulating materials designed to enhance heat dissipation in high-power electronic assemblies.


5. Are your thermal materials suitable for LED and power modules?

Yes. Our thermal solutions are widely applied in LED lighting systems, inverters, IGBT modules, and power supplies.


6. Are your adhesives electrically insulating?

Most structural and thermal adhesives are electrically insulating with high dielectric strength unless specifically designed as conductive grades.


7. Do you offer electrically conductive adhesives?

Yes. Silver-filled conductive adhesives are available for grounding, EMI shielding, and selective circuit bonding applications.


8. What curing mechanisms are supported?

We provide heat-cure, room-temperature cure, moisture cure, UV cure, and dual-cure systems (UV + heat or UV + moisture).


9. Are UV-curable systems suitable for high-speed production lines?

Yes. UV adhesives provide rapid curing and are ideal for precision bonding in automated electronics assembly.


10. Do you provide potting and encapsulation materials?

Yes. We offer epoxy, silicone, and polyurethane encapsulants for environmental protection and mechanical reinforcement.


11. Are your encapsulants compatible with automated dispensing equipment?

Yes. Our materials are optimized for robotic dispensing, jetting systems, and inline production processes.


12. Do you offer low-viscosity grades for improved flow performance?

Yes. Low-viscosity formulations are available to minimize voids in dense PCB assemblies.


13. Are flame-retardant formulations available?

Selected grades are available to meet flame-retardant requirements for safety-critical electronics.


14. What operating temperature range can your materials withstand?

Depending on formulation, our materials are designed for standard and elevated operating temperatures typical in electronic systems.


15. Are your materials suitable for automotive electronics?

Yes. We provide materials engineered to withstand vibration, humidity, and thermal cycling common in automotive environments.


16. Do you offer low-modulus materials for stress-sensitive components?

Yes. Flexible silicone systems are designed to reduce mechanical stress on delicate electronic components.


17. Are low-CTE formulations available for semiconductor packaging?

Yes. Low coefficient of thermal expansion (CTE) materials are available to reduce thermo-mechanical mismatch.


18. Are your materials resistant to thermal cycling?

Yes. Many formulations are developed for long-term reliability under repeated thermal cycling conditions.


19. Do you provide conformal coating solutions?

Yes. Protective coatings are available to shield PCBs from moisture, dust, and corrosion.


20. Are your products compliant with RoHS and REACH regulations?

Yes. Compliance documentation is available upon request.


21. Do you provide Technical Data Sheets (TDS) and Safety Data Sheets (SDS)?

Yes. Full technical and safety documentation is provided for all standard products.


22. Is lot traceability implemented in your production process?

Yes. All materials are traceable by batch number to ensure quality consistency.


23. Can you support customized adhesive development?

Yes. We offer tailored solutions based on customer-specific application and performance requirements.


24. Can viscosity or cure profile be adjusted?

Within technical feasibility, we can optimize viscosity, working time, and curing speed to match production processes.


25. Do you support pilot production validation?

Yes. Engineering support is available during prototype evaluation and production ramp-up.


26. What packaging options are available?

Products are supplied in syringes, cartridges, pails, and drums for various manufacturing scales.


27. What is the typical shelf life?

Shelf life varies depending on product chemistry. Please refer to the specific TDS for storage and expiration guidelines.


28. Do you offer global logistics support?

Yes. International shipping and export documentation support are available.


29. Can long-term supply programs be arranged?

Yes. We support strategic sourcing and long-term supply agreements for key customers.


30. How can we request a quotation or technical consultation?

Please contact our sales and engineering team via the official website contact page for prompt assistance.

 

 

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Contact Us: Tony.Wang@colltechnobelpla.com

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