Key Features:
UV photosolid acrylic for sealing and bonding glass to a variety of substrates.
Typical applications are lamp component bonding,
excellent impact or vibration resistance, low shrinkage and stress during curing
Product Name :
NOBELPLA14905Color :
TransparentHardness :
76 DLap Shear Strength [MPa] :
25 (PC to PC)Note :
CustomizableViscosity [mPa.s] :
2500Curing Condition :
@365nm,100mW/cm2 for 30 secs
| Category | Description |
|---|---|
| Product Name | NOBELPLA14905 |
| Application | Adhesive Solution of Consumer Electronics Adhesives such as Smart Speaker |
| Function | Structural Bonding |
| Curing Method | UV Curing |
| Chemistry | Acrylate |
| Adhesive Type | UV photosolid acrylic adhesive |
| Color | Transparent |
| Viscosity | 2500 mPa·s |
| Curing Condition | UV @ 365 nm, 100 mW/cm², 30 seconds |
| Hardness | Shore D 76 |
| Tensile Strength | 25 MPa (PC to PC) |
| Key Performance Features | Excellent impact and vibration resistance; low shrinkage and low internal stress during curing |
| Substrate Compatibility | Glass, PC, and various electronic substrates |
| Customization | Formulation and specifications available upon request |



We provide high-performance structural adhesives, thermally conductive materials, encapsulants, potting compounds, UV-curable systems, and electrically conductive adhesives for advanced electronics applications.
Our solutions are widely used in PCB assembly, automotive electronics, power modules, LED lighting, battery systems, industrial automation, and semiconductor-related applications.
We offer epoxy, silicone (RTV and addition-cure), acrylic, polyurethane, UV-curable, and hybrid polymer systems designed for electronic reliability requirements.
Yes. Our thermally conductive materials improve heat dissipation while maintaining electrical insulation, ideal for power electronics and LED modules.
TIMs are commonly used in IGBT modules, inverters, power supplies, battery packs, heat sinks, and high-density PCB assemblies.
Most structural and thermal materials are electrically insulating with high dielectric strength unless specifically formulated as conductive grades.
Yes. Silver-filled conductive adhesives are available for EMI shielding, grounding, and selective electrical bonding applications.
We offer heat-cure, room-temperature cure, moisture cure, UV cure, and dual-cure (UV + heat or UV + moisture) systems.
Yes. UV systems provide rapid curing and high throughput, making them ideal for precision electronic assembly.
Yes. We supply epoxy, silicone, and polyurethane encapsulants for environmental protection and mechanical reinforcement.
Yes. Our materials are optimized for robotic dispensing, jetting equipment, and inline manufacturing processes.
Yes. Low-viscosity formulations are designed to enhance penetration and minimize void formation.
Selected products meet flame-retardant requirements for safety-critical electronic assemblies.
Depending on formulation, materials are engineered to withstand both standard and elevated operating temperatures typical in electronic devices.
Yes. We offer materials engineered to withstand vibration, thermal cycling, humidity, and harsh automotive conditions.
Yes. Flexible silicone systems help reduce mechanical stress on delicate electronic components.
Yes. Low coefficient of thermal expansion (CTE) systems are available to reduce thermo-mechanical mismatch.
Yes. Many formulations are designed for long-term reliability under repeated thermal cycling conditions.
Yes. Protective coatings are available to shield PCBs from moisture, dust, and corrosion.
Yes. Compliance documentation is available upon request.
Yes. Full technical and safety documentation is provided for standard products.
Yes. All materials are traceable by batch number to ensure quality consistency.
Yes. Custom development is available based on specific application and performance requirements.
Within technical feasibility, viscosity, working time, and curing speed can be optimized for production needs.
Yes. Technical assistance is available during validation and process optimization stages.
Products are supplied in syringes, cartridges, pails, and drums for different manufacturing scales.
Shelf life varies by product chemistry. Please refer to the relevant TDS for storage recommendations.
Yes. We offer international shipping and export documentation services.
Yes. We support structured supply programs for strategic customers.
Please contact our sales and engineering team via the official website contact page for prompt assistance.
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