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thermally conductive epoxy adhesive

thermally conductive epoxy adhesive

Adhesive Solutions for TV; Thermal for Mainboard Chips Al + EMC NOBELPLA 87455
Key Features: NOBELPLA 87455 is a highly filled compound that is not flowing. This product is suitable for applications that require moderate thermal conductivity. The material is easy to remove from the substrate. Typical applications include thermal management of heat sinks, memory and chips, power transistors, and CPUs.

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Contact Us: Tony.Wang@colltechnobelpla.com

00852-46199317
Tony.Wang@colltechnobelpla.com
00852-46199317
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