Key Features:
Two-component acrylic for structural bonding of a variety of materials such as plastics, metals, ceramics,
and wood, low odor, excellent high temperature resistance, fast curing at room temperature, no special surface treatment
Product Name :
NOBELPLA29196Color :
Orange / RedViscosity [mPa.s] :
9000Hardness :
70DLap Shear Strength [MPa] :
32 (Al to Al)Note :
CustomizableFixture Time [min] :
5-10
| Item | Specification / Description |
|---|---|
| Product Name | NOBELPLA29196 |
| Product Type | Two-Component Acrylic Structural Adhesive |
| Target Application | Charger end membrane assembly; multi-material structural bonding |
| Chemistry | Acrylate |
| Curing Mechanism | Two-component reactive curing at room temperature |
| Color | Orange / Red |
| Viscosity | 9,000 mPa·s |
| Hardness | Shore D 70 |
| Fixture Time | 5–10 minutes |
| Lap Shear Strength | 32 MPa (Al to Al) |
| Primary Function | Structural Bonding |
| Substrate Compatibility | Plastics, metals, ceramics, wood, and composite materials |
| Surface Preparation | No special surface treatment required |
| Thermal Resistance | Excellent high-temperature resistance |
| Odor Level | Low odor formulation |
| Customization | Formulation customizable based on bonding and processing requirements |
NOBELPLA29196 is a high-strength, two-component acrylic structural adhesive engineered for charger end membrane assembly and multi-material bonding applications. Designed for room-temperature curing, the system provides rapid fixture within 5–10 minutes, enabling efficient production throughput.
With a lap shear strength of 32 MPa (Al-to-Al) and Shore D hardness of 70, the cured adhesive delivers exceptional structural integrity and load-bearing capability. The formulation bonds effectively to plastics, metals, ceramics, wood, and other substrates without requiring special surface pretreatment, simplifying manufacturing processes.
Featuring low odor and excellent high-temperature resistance, NOBELPLA29196 offers a robust and reliable structural bonding solution for electronic device assemblies requiring high mechanical performance and process efficiency.

We specialize in high-performance thermal interface materials (TIMs), structural bonding adhesives, encapsulation and potting systems, conformal coatings, and electrically conductive adhesives engineered for demanding electronic applications.
Our solutions are widely used in power electronics, automotive electronics, LED lighting modules, battery management systems (BMS), industrial automation equipment, and communication infrastructure.
Our formulations are developed using epoxy, silicone (RTV and addition-cure), polyurethane, acrylic, UV-curable, and hybrid polymer systems optimized for thermal stability and mechanical durability.
We provide thermal greases, gap fillers, thermal gels, thermally conductive potting compounds, and thermally conductive structural adhesives to accommodate diverse heat dissipation architectures.
Through optimized filler particle size distribution, high packing density, and enhanced substrate wetting characteristics, our materials effectively reduce interfacial thermal resistance.
Thermal conductivity varies depending on filler technology and formulation design. Multiple grades are available to meet different heat flux and power density requirements.
Yes. Most TIM grades combine high thermal conductivity with excellent dielectric strength and high volume resistivity, ensuring safe electrical insulation.
Yes. Silver-filled conductive adhesives are available for grounding, EMI shielding, and selective electrical interconnection applications.
Our portfolio includes heat curing, room-temperature curing (RTV), moisture curing, UV curing, and dual-cure systems compatible with various production environments.
Yes. Rheological properties are precisely engineered for needle dispensing, jetting systems, screen printing, and robotic inline manufacturing.
Surface-modified fillers and anti-settling technologies are applied to maintain consistent viscosity and prevent phase separation.
Yes. Flexible silicone and hybrid elastomer systems help absorb stress caused by CTE mismatch and thermal cycling.
Proper control of the Coefficient of Thermal Expansion (CTE) reduces thermo-mechanical fatigue and enhances long-term reliability.
Selected grades are engineered to maintain adhesion strength, dielectric stability, and mechanical integrity under repeated temperature fluctuations.
We supply epoxy and silicone encapsulants designed to protect components from moisture ingress, vibration, dust contamination, and chemical exposure.
Yes. Certain formulations are developed to meet flame-retardancy requirements for safety-critical electronic systems.
Yes. Our conformal coatings protect circuit boards against humidity, corrosion, ionic contamination, and environmental stress.
Thermal conductivity, dielectric strength, dielectric constant, dissipation factor (tan δ), volume resistivity, glass transition temperature (Tg), CTE, modulus, adhesion strength, rheology profile, and aging stability are comprehensively assessed.
Strict raw material qualification, controlled manufacturing processes, statistical process control (SPC), and full lot traceability guarantee batch-to-batch reliability.
Yes. Our products comply with major global directives including RoHS and REACH.
Yes. We offer application-driven customization to optimize thermal conductivity, curing profile, flexibility, adhesion strength, and process compatibility.
Yes. Engineering samples are available for laboratory evaluation, pilot production, and qualification programs.
Yes. Our products are engineered to withstand vibration, humidity, and harsh temperature environments typical of automotive systems.
Depending on chemistry selection, materials are designed to perform reliably across wide operational temperature ranges.
Low moisture absorption polymer networks and optimized crosslink density help maintain dielectric and mechanical stability under humid conditions.
Yes. Select formulations are engineered to minimize ionic contamination and volatile emissions in sensitive electronic assemblies.
Products are supplied in syringes, cartridges, dual cartridges, pails, and drums to accommodate both R&D and mass production needs.
Shelf life is validated through accelerated aging studies and real-time storage testing under defined environmental conditions.
We provide Technical Data Sheets (TDS), Safety Data Sheets (SDS), and application guidelines to support engineering integration.
Customers may contact our sales and technical teams through our official website to request samples, quotations, and engineering consultation.
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