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High-Strength Two-Component Acrylic Structural Adhesive for Electronics Bonding & Assemblies, NOBELPLA29196

High-Strength Two-Component Acrylic Structural Adhesive for Electronics Bonding & Assemblies, NOBELPLA29196

Key Features: 

Two-component acrylic for structural bonding of a variety of materials such as plastics, metals, ceramics,

and wood, low odor, excellent high temperature resistance, fast curing at room temperature, no special surface treatment

 

 

  • Product Name :

    NOBELPLA29196
  • Color :

    Orange / Red
  • Viscosity [mPa.s] :

    9000
  • Hardness :

    70D
  • Lap Shear Strength [MPa] :

    32 (Al to Al)
  • Note :

    Customizable
  • Fixture Time [min] :

    5-10
Inquiry Now

 

Advanced Structural Acrylic Adhesive for Multi-Material Electronic Assembly, NOBELPLA29196

 

Item Specification / Description
Product Name NOBELPLA29196
Product Type Two-Component Acrylic Structural Adhesive
Target Application Charger end membrane assembly; multi-material structural bonding
Chemistry Acrylate
Curing Mechanism Two-component reactive curing at room temperature
Color Orange / Red
Viscosity 9,000 mPa·s
Hardness Shore D 70
Fixture Time 5–10 minutes
Lap Shear Strength 32 MPa (Al to Al)
Primary Function Structural Bonding
Substrate Compatibility Plastics, metals, ceramics, wood, and composite materials
Surface Preparation No special surface treatment required
Thermal Resistance Excellent high-temperature resistance
Odor Level Low odor formulation
Customization Formulation customizable based on bonding and processing requirements

 

 


Product Summary

NOBELPLA29196 is a high-strength, two-component acrylic structural adhesive engineered for charger end membrane assembly and multi-material bonding applications. Designed for room-temperature curing, the system provides rapid fixture within 5–10 minutes, enabling efficient production throughput.

With a lap shear strength of 32 MPa (Al-to-Al) and Shore D hardness of 70, the cured adhesive delivers exceptional structural integrity and load-bearing capability. The formulation bonds effectively to plastics, metals, ceramics, wood, and other substrates without requiring special surface pretreatment, simplifying manufacturing processes.

Featuring low odor and excellent high-temperature resistance, NOBELPLA29196 offers a robust and reliable structural bonding solution for electronic device assemblies requiring high mechanical performance and process efficiency.

 

 

 

 

Advanced Electronic Materials – Technical FAQ


1. What are the core competencies of COLLTECH NOBELPLA?

We specialize in high-performance thermal interface materials (TIMs), structural bonding adhesives, encapsulation and potting systems, conformal coatings, and electrically conductive adhesives engineered for demanding electronic applications.


2. Which industries are primarily served by your materials?

Our solutions are widely used in power electronics, automotive electronics, LED lighting modules, battery management systems (BMS), industrial automation equipment, and communication infrastructure.


3. What polymer chemistries form the foundation of your products?

Our formulations are developed using epoxy, silicone (RTV and addition-cure), polyurethane, acrylic, UV-curable, and hybrid polymer systems optimized for thermal stability and mechanical durability.


4. What types of Thermal Interface Materials (TIMs) do you offer?

We provide thermal greases, gap fillers, thermal gels, thermally conductive potting compounds, and thermally conductive structural adhesives to accommodate diverse heat dissipation architectures.


5. How do your TIMs improve thermal management performance?

Through optimized filler particle size distribution, high packing density, and enhanced substrate wetting characteristics, our materials effectively reduce interfacial thermal resistance.


6. What thermal conductivity levels can be achieved?

Thermal conductivity varies depending on filler technology and formulation design. Multiple grades are available to meet different heat flux and power density requirements.


7. Are your thermally conductive materials electrically insulating?

Yes. Most TIM grades combine high thermal conductivity with excellent dielectric strength and high volume resistivity, ensuring safe electrical insulation.


8. Do you offer electrically conductive adhesives (ECA)?

Yes. Silver-filled conductive adhesives are available for grounding, EMI shielding, and selective electrical interconnection applications.


9. What curing technologies are available?

Our portfolio includes heat curing, room-temperature curing (RTV), moisture curing, UV curing, and dual-cure systems compatible with various production environments.


10. Are your materials suitable for automated dispensing processes?

Yes. Rheological properties are precisely engineered for needle dispensing, jetting systems, screen printing, and robotic inline manufacturing.


11. How is viscosity stability ensured during storage?

Surface-modified fillers and anti-settling technologies are applied to maintain consistent viscosity and prevent phase separation.


12. Do you provide low-modulus materials for stress-sensitive assemblies?

Yes. Flexible silicone and hybrid elastomer systems help absorb stress caused by CTE mismatch and thermal cycling.


13. Why is CTE control critical in electronic packaging?

Proper control of the Coefficient of Thermal Expansion (CTE) reduces thermo-mechanical fatigue and enhances long-term reliability.


14. How do your materials perform under thermal cycling conditions?

Selected grades are engineered to maintain adhesion strength, dielectric stability, and mechanical integrity under repeated temperature fluctuations.


15. What encapsulation solutions are available?

We supply epoxy and silicone encapsulants designed to protect components from moisture ingress, vibration, dust contamination, and chemical exposure.


16. Are flame-retardant grades available?

Yes. Certain formulations are developed to meet flame-retardancy requirements for safety-critical electronic systems.


17. Do you offer conformal coatings for PCB protection?

Yes. Our conformal coatings protect circuit boards against humidity, corrosion, ionic contamination, and environmental stress.


18. What key parameters are evaluated during product development?

Thermal conductivity, dielectric strength, dielectric constant, dissipation factor (tan δ), volume resistivity, glass transition temperature (Tg), CTE, modulus, adhesion strength, rheology profile, and aging stability are comprehensively assessed.


19. How is product consistency ensured?

Strict raw material qualification, controlled manufacturing processes, statistical process control (SPC), and full lot traceability guarantee batch-to-batch reliability.


20. Are your materials compliant with international environmental regulations?

Yes. Our products comply with major global directives including RoHS and REACH.


21. Can formulations be customized to meet specific application needs?

Yes. We offer application-driven customization to optimize thermal conductivity, curing profile, flexibility, adhesion strength, and process compatibility.


22. Do you support prototype validation and reliability testing?

Yes. Engineering samples are available for laboratory evaluation, pilot production, and qualification programs.


23. Are your materials suitable for automotive-grade electronics?

Yes. Our products are engineered to withstand vibration, humidity, and harsh temperature environments typical of automotive systems.


24. What operating temperature ranges can your materials support?

Depending on chemistry selection, materials are designed to perform reliably across wide operational temperature ranges.


25. How do you address moisture resistance requirements?

Low moisture absorption polymer networks and optimized crosslink density help maintain dielectric and mechanical stability under humid conditions.


26. Are low-ionic or low-outgassing grades available?

Yes. Select formulations are engineered to minimize ionic contamination and volatile emissions in sensitive electronic assemblies.


27. What packaging formats are supported?

Products are supplied in syringes, cartridges, dual cartridges, pails, and drums to accommodate both R&D and mass production needs.


28. How is shelf life determined?

Shelf life is validated through accelerated aging studies and real-time storage testing under defined environmental conditions.


29. What technical documentation is provided?

We provide Technical Data Sheets (TDS), Safety Data Sheets (SDS), and application guidelines to support engineering integration.


30. How can customers initiate cooperation with COLLTECH NOBELPLA?

Customers may contact our sales and technical teams through our official website to request samples, quotations, and engineering consultation.

 

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Contact Us: Tony.Wang@colltechnobelpla.com

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