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Industrial Electronic Structural Adhesive for PCB & Component Reinforcement, NOBELPLA51031

Industrial Electronic Structural Adhesive for PCB & Component Reinforcement, NOBELPLA51031

Key Features: 

Two-component epoxy for bonding or reinforcing electronic components,

excellent adhesion to a variety of substrates, high thixotropy,

long operating time, easy to apply in a variety of ways

 

 

  • Product Name :

    NOBELPLA51031
  • Color :

    Black / Light yellow
  • Viscosity [mPa.s] :

    41000
  • Mixture Ratio :

    2:1
  • Hardness :

    95D
  • Lap Shear Strength [MPa] :

    25 (Al to Al)
  • Note :

    Customizable
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Two-Part Epoxy Adhesive for Electronics Manufacturing & Smart Appliance Bonding, NOBELPLA51031

 

Item Specification / Description
Product Name NOBELPLA51031
Product Type Two-Component Epoxy Adhesive
Target Application Smart home appliance electronics; bonding and reinforcement of electronic components
Chemistry Epoxy
Curing Mechanism Two-component reactive curing
Mixture Ratio 2:1 (resin : hardener)
Color Black / Light Yellow
Viscosity 41,000 mPa·s
Hardness Shore D 95
Lap Shear Strength 25 MPa (Al to Al)
Primary Functions Structural Bonding; Component Reinforcement
Thixotropy High thixotropic behavior for precise dispensing and minimal flow
Open / Working Time Long operating time for assembly flexibility
Substrate Compatibility Excellent adhesion to metals, plastics, and other electronic substrates
Customization Formulation customizable to meet specific performance and process requirements

 

 


Product Summary

 

NOBELPLA51031 is a high-performance, two-component epoxy adhesive designed for bonding and reinforcing electronic components in smart home appliances. The material exhibits high thixotropy, allowing precise application and minimal flow during assembly, while providing long working time to accommodate complex manufacturing processes.

With a Shore D hardness of 95 and lap shear strength of 25 MPa (Al-to-Al), the adhesive delivers excellent structural integrity and mechanical reliability. Its broad substrate compatibility ensures strong adhesion to metals, plastics, and other electronic materials.

 

The 2:1 resin-to-hardener ratio and high viscosity (41,000 mPa·s) enable controlled dispensing and consistent coverage. Customizable formulations further allow optimization for specific electronic applications, making NOBELPLA51031 a robust and reliable solution for structural bonding in advanced smart home appliance assemblies.

 

 

 

 

 

COLLTECH NOBELPLA High-Performance Electronic Materials – Technical FAQ


1. What core material solutions does COLLTECH NOBELPLA provide?

We develop and manufacture thermally conductive interface materials (TIMs), structural bonding adhesives, encapsulation and potting systems, conformal coatings, and electrically conductive adhesives for advanced electronic assemblies.


2. Which application sectors are primarily served?

Our materials are widely applied in power electronics modules, automotive ECUs, LED lighting systems, battery management systems (BMS), industrial control units, communication hardware, and electronic packaging solutions.


3. What polymer chemistries form the basis of your technologies?

Our formulations are built on epoxy, silicone (RTV and addition-cure), polyurethane, acrylic, UV-curable, and hybrid polymer platforms engineered for long-term reliability and process stability.


4. What types of Thermal Interface Materials (TIMs) are available?

We offer thermal greases, thermal gap fillers, thermal gels, thermally conductive potting compounds, and thermally conductive structural adhesives designed for various thermal architectures.


5. How do your TIMs reduce interfacial thermal resistance?

Through optimized filler morphology, controlled particle packing density, and enhanced wetting behavior, our materials minimize air entrapment and improve surface conformity.


6. What thermal conductivity levels can be achieved?

Thermal conductivity performance depends on filler type and loading strategy. Multiple grades are engineered to address different power density and heat flux requirements.


7. Are your thermally conductive materials electrically insulating?

Yes. Most TIM grades provide high dielectric strength, high volume resistivity, and reliable electrical insulation for power devices.


8. Do you offer electrically conductive adhesives (ECA)?

Yes. Silver-filled conductive systems are available for grounding, EMI shielding, and selective electrical interconnection.


9. What curing technologies are supported?

We offer heat-curing, room-temperature curing (RTV), moisture-curing, UV-curing, and dual-cure systems compatible with diverse manufacturing processes.


10. Are your materials suitable for automated dispensing systems?

Yes. Rheological properties are optimized for needle dispensing, jetting, screen printing, and robotic inline production.


11. How is viscosity stability maintained during storage?

Surface-treated fillers and anti-settling technologies are used to ensure viscosity consistency and extended shelf life.


12. Do you provide low-modulus formulations for stress-sensitive assemblies?

Yes. Flexible silicone and hybrid elastomer systems help absorb stress caused by CTE mismatch and thermal cycling.


13. Why is CTE control critical in electronic packaging?

Proper control of the Coefficient of Thermal Expansion (CTE) reduces thermo-mechanical fatigue, preventing cracking, delamination, and long-term reliability failures.


14. How do your materials perform under thermal cycling conditions?

Selected grades are engineered to maintain adhesion strength, dielectric performance, and mechanical integrity under repeated temperature fluctuations.


15. What encapsulation solutions are available?

We provide epoxy and silicone encapsulants designed to protect components from moisture ingress, vibration, dust contamination, and chemical exposure.


16. Are flame-retardant grades offered?

Yes. Certain formulations are designed to meet flame-retardancy requirements for safety-critical electronic systems.


17. Do you offer conformal coatings for PCB protection?

Yes. Our conformal coatings provide environmental protection against humidity, corrosion, ionic contamination, and surface leakage.


18. What key parameters are evaluated during material development?

Thermal conductivity, dielectric strength, dielectric constant, volume resistivity, glass transition temperature (Tg), CTE, modulus, adhesion strength, rheology profile, and long-term aging stability.


19. How do you ensure batch-to-batch consistency?

Strict raw material qualification, controlled manufacturing processes, and comprehensive quality management systems ensure full lot traceability and reproducibility.


20. Are your materials compliant with global environmental regulations?

Yes. Our products comply with major international standards including RoHS and REACH.


21. Can formulations be customized for specific customer requirements?

Yes. We provide application-driven customization to optimize thermal conductivity, flexibility, curing speed, adhesion performance, and process compatibility.


22. Do you support prototype validation and reliability testing?

Yes. We assist customers with sample evaluation, pilot production trials, and qualification programs.


23. Are your materials suitable for automotive-grade applications?

Yes. Our products are engineered to withstand vibration, humidity, and harsh temperature environments typical of automotive electronics.


24. What operating temperature ranges can your materials withstand?

Depending on chemistry selection, materials are designed to perform reliably across wide operational temperature conditions.


25. How do you address moisture resistance requirements?

Low moisture absorption polymer networks and controlled crosslink density help maintain dielectric and mechanical stability under high humidity.


26. Are low-ionic or low-outgassing grades available?

Yes. Select formulations are developed to minimize ionic contamination and volatile emissions in sensitive electronic assemblies.


27. What packaging formats are supported?

Products are supplied in syringes, cartridges, dual cartridges, pails, and drums to support both R&D and mass production.


28. How is shelf life determined?

Shelf life is validated through accelerated aging testing and defined in each Technical Data Sheet under recommended storage conditions.


29. What documentation is available?

We provide Technical Data Sheets (TDS), Safety Data Sheets (SDS), and application guidelines upon request.


30. How can customers initiate technical collaboration?

Customers may contact our sales and engineering teams through our official website to request samples, quotations, and technical consultation.

 

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Contact Us: Tony.Wang@colltechnobelpla.com

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