Underfill Adhesive Solutions for Solid-State Drives (SSDs) and Storage Device NOBELPLA67109

NOBELPLA67109 – Heat-Curing Epoxy Underfill for SSDs and Storage Devices

Product Summary

NOBELPLA67109 is a high-performance, one-component, heat-curing epoxy underfill designed for SSDs and other storage device applications. It provides excellent protection for chips, ensuring stress relief and mechanical stability with a high glass transition temperature (Tg) and low coefficient of thermal expansion (CTE).

With a Shore D hardness of 95, lap shear strength of 41 MPa (Silicon-to-FR4), and solvent-free 3,000 mPa·s viscosity, NOBELPLA67109 delivers strong adhesion, high thermal and moisture resistance, and reliable encapsulation performance. The material cures rapidly at 150°C for 30 minutes, supporting efficient automated underfill processes.

Customizable formulations allow optimization for different substrate materials, thermal management needs, and mechanical requirements, making NOBELPLA67109 a robust solution for high-reliability SSD and storage device manufacturing.

COLLTECH NOBELPLA – Electronic Adhesives & Materials Technical FAQ

1. What types of electronic adhesive products do you offer?

We supply high-performance structural adhesives, thermally conductive interface materials (TIMs), encapsulants, potting compounds, UV-curable adhesives, and electrically conductive adhesives tailored for electronic applications.

2. Which electronic applications do your materials serve?

Our materials are used in PCB assembly, power electronics, LED lighting modules, automotive electronics, battery packs, industrial control systems, and semiconductor-related components.

3. What core chemistries are available in your product portfolio?

We offer epoxy, silicone (RTV and addition cure), acrylic, polyurethane, UV-curable, and hybrid polymer systems optimized for reliability and performance.

4. What is a thermal interface material (TIM)?

A TIM is a thermally conductive material placed between heat-generating components and heat sinks to facilitate efficient heat transfer and reduce thermal resistance.

5. Are your thermally conductive materials electrically insulating?

Yes. Most of our thermally conductive materials are engineered to provide both efficient heat dissipation and high electrical insulation.

6. Can your materials be used in high-power electronics?

Yes. Our thermal management materials and structural adhesives are suitable for high-power applications such as inverters, power supplies, and IGBT modules.

7. Do you offer electrically conductive adhesives?

Yes. Silver-filled conductive adhesives are available for EMI shielding, grounding, flexible circuitry, and selective electrical bonding applications.

8. What curing mechanisms are supported?

Our products support a variety of curing mechanisms, including heat cure, room-temperature cure, moisture cure, UV cure, and dual-cure (UV + heat/moisture) systems.

9. Are your materials compatible with automated manufacturing processes?

Yes. All formulations are optimized for robotic dispensing, jetting systems, valve-controlled dispensing, and high-volume automated assembly.

10. Do you offer low-viscosity grades for better flow performance?

Yes. Low-viscosity materials provide improved flow and wetting, ideal for potting and encapsulation of densely populated boards.

11. Are non-sagging formulations available?

Yes. Our non-sag and high-thixotropy grades are designed for vertical surfaces and precision applications.

12. What are typical temperature performance ranges?

Operating temperature ranges vary by product; many materials are designed to perform at both standard and elevated temperatures relevant to electronics operation.

13. Do your materials resist thermal cycling?

Yes. Many formulations are engineered to withstand thermal cycling and maintain mechanical and electrical integrity over time.

14. Do you offer low-modulus materials for stress-sensitive components?

Yes. Flexible silicone and hybrid systems help alleviate stress caused by coefficient of thermal expansion (CTE) mismatch.

15. What is CTE and why is it important?

CTE (Coefficient of Thermal Expansion) measures how much a material expands or contracts with temperature. Matching CTE helps reduce mechanical stress in multi-material assemblies.

16. Are your encapsulants suitable for environmental protection?

Yes. Our encapsulants protect against moisture, vibration, chemical exposure, and mechanical shock.

17. Are flame-retardant products available?

Yes. We offer flame-retardant grades designed to meet safety and flame-resistance requirements in electronic systems.

18. Do you provide conformal coating materials?

Yes. Our conformal coatings protect PCBs and assemblies from moisture, dust, corrosion, and environmental contaminants.

19. Are your materials compliant with global environmental standards?

Yes. Many products are RoHS and REACH compliant. Relevant compliance documentation is available upon request.

20. Do you provide technical documentation like TDS and SDS?

Absolutely. We provide Technical Data Sheets (TDS), Safety Data Sheets (SDS), and process guidelines for all products.

21. Is lot traceability supported in your manufacturing?

Yes. Full batch traceability ensures consistent material quality and reproducibility for high-reliability applications.

22. Can you customize material formulations?

Yes. We offer custom formulation development based on specific application requirements such as conductivity, adhesion, thermal performance, and rheology.

23. Can viscosity and curing profiles be adjusted for specific processes?

Yes. Within technical feasibility, working time, viscosity, and cure speed can be optimized to fit customer processes.

24. Do you provide support for prototype validation and pilot runs?

Yes. Our technical team offers application support, sample recommendations, and pilot production assistance.

25. Are your materials suitable for automotive-grade applications?

Yes. Our products are engineered to meet vibration, humidity, and temperature cycling requirements typical in automotive electronics.

26. What packaging formats are available?

Materials are supplied in cartridges, syringes, pails, and drums to support laboratory evaluation and high-volume manufacturing.

27. What is the typical shelf life?

Shelf life varies depending on product chemistry. Specific storage guidance is detailed in the TDS.

28. Do you support global logistics and export services?

Yes. We handle international logistics coordination and provide necessary export documentation.

29. Can you provide performance testing data upon request?

Yes. Performance data, reliability test summaries, and material qualification information are available for qualified projects.

30. How can customers request samples or get technical consultation?

Customers may contact our sales and technical support team through the official website to request samples, quotations, or application guidance.