High-Performance Thermal Conductive Adhesive for HVAC & Appliance PCB Thermal Solutions, NOBELPLA87455
Key Features:
flowing, highly filled compound, typical applications include thermal management of heat sinks,
memory and chips, power transistors and CPUs, high thermal conductivity,
low modulus and mechanical stress, easy coating and removal with alcohol or acetone,
high temperature resistance, good high temperature cycle reliability, low oil permeability