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BGA CSP Thermal Adhesive

BGA CSP Thermal Adhesive

Adhesive Solution for Tablet PC Component Underfilling Chips (BGA, CSP, QFN) NOBELPLA67109
Key Features: Heat-curing low fill, used for CSP or BGA solder joint protection underfill, can be reworked, good compatibility with flux, good flow and fast curing, excellent resistance to mechanical stress and warm stamping

Hot Tags : Tablet PC SMT Glue Industrial Super Glue Chip Underfill Structural Adhesive BGA CSP Thermal Adhesive Component Structural Bonding thermal adhesive glue super glue metal to metal thermal conductive glue

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Contact Us: Tony.Wang@colltechnobelpla.com

00852-46199317
Tony.Wang@colltechnobelpla.com
00852-46199317
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