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adhesive glue manufacturer

adhesive glue manufacturer

High-Performance Adhesive for SSD Chip Underfill and Structural Strength, Featuring NOBELPLA 67109
Key Features: NOBELPLA 67109 is a one-component, solvent-free, heat-curing epoxy adhesive suitable for use as a basefill to protect chips, with good adhesion to a variety of substrates, excellent high temperature and moisture resistance, high Tg and low CTE

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If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.

Contact Us: Tony.Wang@colltechnobelpla.com

00852-46199317
Tony.Wang@colltechnobelpla.com
00852-46199317
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